alpha助焊剂RF800T
发布时间 2014-09-28 18:59:41
产品描述
ALPHA助焊剂
●免清洗，水溶性，低VOC ，无卤素。
●新的ALPHA阿尔法通常能够应付未来的挑战，既有铅和无铅化进程。
●ALPHA阿尔法能够提供环保效益，同时提供无与伦比的焊接性能。
ALPHA阿尔法能够提供无可比拟波峰焊接过程中的解决方法，其酒精含量为基础的通量提供良好的润湿，几乎无缺陷的焊接和高线吞吐量全国各地全面的应用范围。
阿尔法助焊剂RF800T
Alpha Metals RF800T
No-Clean Flux
FEATURES BENEFITS
? Medium Solids
Content
? Pin Testable
? Non Corrosive
Residues
? High Sir Assemblies
DESCRIPTION
Alpha RF 800T
is a low solids,
no-clean flux formulated
with a small
percentage of rosin
and non-halide
activators. This unique rosin activation system
promotes excellent wetting to protected copper and solder
coated
surfaces. Post soldering
residue of Alpha RF
800T is minimal,
slightly glossy and can
be pin tested without
removal.
USE
Alpha RF 800T flux is formulated to be applied with foam, wave,
spray and mist fluxers. Flux deposition, density
and uniformity are critical to successful use of low solids
no-clean
flux.
Applying RF 800T to a dry flux coating
density of 100 to 300 micrograms per square centimetre is
recommended.
Preheating the circuit assembly will
partially dry the
flux, enhance oxide
removal and promote
optimum wicking, as
well as superior
solder joint
formation. Degree of preheat is dependent on many
variables; such as conveyor speed, type of components and
substrates.
Entering the solder
wave with a top-side
temperature of 90°C
to 110°C and a
bottom-side
temperature of 120°C to 155°C is typical.
The foam applicators
should be supplied
with compressed air,
free of oil and
water. Maintain flux
fluid level
sufficiently above the aerator to produce adequate foam
height.
Adjust air pressure to produce optimum height
with foam consisting
of uniform bubbles. The
addition of flux
thinners will be
required to replace
evaporative
losses and maintain
the balance in flux
composition. Due to the
low solids content of
Alpha RF 800T flux,
specific gravity is
not an accurate
measure for assessment.
Monitoring and controlling
the acid number is
recommended for maintaining the flux
composition.
The acid number should be controlled between 21 and 22.
Page 1 - RF800
The information contained in this document has been prepared in
good faith and is offered at no charge. No warranty is given
that the information herein is accurate or complete.
Errors and omissions excepted. It is the buyers responsibility to
determine
the products fitness for any particular purpose.
REV0501
In time, debris and contaminants will accumulate in recirculating
type flux applicators. For consistent soldering
performance, dispose of
spent flux in accordance
with local bylaws,
rules and regulations
periodically. After
emptying used flux, the reservoir and applicator should be
thoroughly cleaned with flux thinner. Refill reservoir
with fresh flux and
allow a few minutes
to stabilise before
resuming soldering operation.
In this type of
flux
application equipment, replace flux every 3 days where used daily
for eight hours or more.
Although Alpha RF 800T is designed to be left on the board, if
desired, post soldering residues can be removed
with Alpha 2110 saponifier,
Hydrex DX detergent or
alternatively a semi-aqueous
process using Alpha Auto
Clean 40 may be employed.
Key factors for no-clean soldering: Start with clean boards and
components. Maintain uniform flux coating.
Separate boards to prevent flux carry-over.
GENERAL GUIDELINES FOR MACHINE SETTINGS
OPERATING
PARAMETER
TYPICAL LEVEL
Amount of Flux
Applied
2
Foam, Wave: 150 - 300 μg/cc of solids
2
Spray: 150 - 200 μg/cc of solids
When foam fluxing
..................................................................
Foam Stone Pore
Size
20 -50 μm
Distance that top of stone is
submerged below
flux
25 - 40 mm (1 - 1? inches )
Foam Fluxer Chimney
Opening
10-13 mm ( 3/8 - 1/2 inch)
Topside Preheat
Temperature
90°C – 100°C
Bottomside Preheat
Temperature
abouthttp://www.3566t.com/sell/syudz/2602054.html
http://www.35667.com/ 35°C higher than topside
Maximum Ramp Rate of Topside Temperature (to
avoid
2°C/second maximum
component damage)
Conveyor
Angle
5°-8° (6° most common)
Conveyor
Speed
4 - 6 feet/minute (1.2 - 1.5 meters/minute)
Contact Time in the Solder (includes Chip Wave and
Primary
1.5 - 3.5 seconds (2-2? seconds most common)
Wave)
Solder Pot
Temperature
Nominal 245°C
These are general guidelines which have proven to yield excellent
results; however, depending upon your equipment,
components, and circuit boards, your optimal settings may be
different. In order to optimize your process, it is
recommended to perform a designed experiment, optimizing the most
important variables (amount of flux applied,
conveyor speed, topside preheat temperature, and solder pot
temperature).
TECHNICAL SPECIFICATIONS
Parameters
Typical
Values
Parameters/Test
Method
Typical Values
Appearance
Pale, yellow liquid Recommended
Thinner
800T Additive
Solids Content,
wt/wt
5.0
Shelf
Life
18 Months
Acid Number (mg
KOH/g)
21.6
Container Size
Availability
20, 200L
Specific Gravity @ 25°C
(77°F)
0.800 ± 0.003
Bellcore TR-NWT-000078, Issue 3
Compliant
Yes
Flash Point
(T.C.C.)
13°C
IPC J-STD-004
Designation
B (RO/L1)